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Fujifilm

Senior Associate Research Chemist

1d

Fujifilm

Mesa, US · Full-time · $125,000 – $165,000

About this role

FUJIFILM Electronic Materials, U.S.A., Inc. is a global leader in chemical solutions enabling the semiconductor industry and digital universe. The Senior Associate Research Chemist supports new Chemical Mechanical Polishing/Planarization (CMP) slurry development. Primary focus is fundamental research and formulation for BEOL slurries in next-generation technologies.

Build comprehensive library of functional chemicals for CMP slurry and cleaner development, including particles, corrosion inhibitors, and oxidants. Develop electrochemical methodologies to screen corrosion inhibitors and explore mechanisms on IC chips. Enhance CMP fundamental studies by identifying root causes and computing theoretical models.

Develop new CMP slurry formulations per customer and technology node needs. Investigate chemistry and abrasive interactions with dielectric and metal films. Coordinate with engineering, lab staff, Applications, R&D, and manufacturing teams on slurry chemistries.

Join state-of-the-art facilities in Mesa, Arizona, and other U.S. sites like California and Rhode Island. Fuel innovation in microchips powering AI, electric vehicles, and smartphones. Connect with FUJIFILM's global network headquartered in Tokyo.

Requirements

  • Knowledge of acids/bases and corrosion inhibitors
  • Expertise in chemical/particle interactions
  • Proficiency in electrochemistry
  • Background in organic/inorganic chemistry
  • Understanding of surfactants and interfacial chemistry
  • Experience with electrochemical methodologies for corrosion screening
  • Familiarity with CMP slurry formulation and chemistry tuning
  • Ability to investigate abrasive interactions with dielectric and metal films

Responsibilities

  • Build comprehensive library of functional chemicals for CMP slurry and cleaner development including particles, corrosion inhibitors, removal rate enhancers, oxidants, and cleaner chemicals
  • Develop electrochemical methodologies to screen corrosion inhibitors and explore corrosion behavior mechanisms on IC chips through integrated electrochemical techniques
  • Enhance competency of CMP-related fundamental studies, find root causes, compute theoretical models, and develop solutions quickly
  • Develop new CMP slurry formulations as per customer and semiconductor technology node needs
  • Apply knowledge of acids/bases, corrosion inhibitors, chemical/particle interactions, electrochemistry, organic/inorganic chemistry, surfactants, and interfacial chemistry to CMP slurry development
  • Investigate chemistry and abrasive interactions with different dielectric and metal films
  • Fine-tune slurry chemistry to achieve desired polishing rates and metrology performance
  • Provide consultation and technical expertise related to CMP slurries’ chemistries to Applications, R&D, and Process Development/Manufacturing teams