Academic Internship - Materials Engineering
1d1 day agoBosch Group
Braga, PT · Full-time · €9,600 – €14,400
About this role
The Bosch Group has more than 400,000 employees around the world, present in 60 countries, impacting people’s lives and working towards a sustainable future. Bosch Car Multimedia belongs to the Automotive Electronics division, focused on making vehicles our third living space. About 3,600 associates develop and produce high-quality technology shaping change in mobility worldwide.
Your contribution involves investigating Cu-pillar Underfill for Semiconductor Applications. Tasks include state-of-the-art review of Underfill in the semiconductor industry and identification of relevant material properties influencing reliability. Material characterization covers thermal analysis, rheology, chemical analysis, DMA, and TMA.
Implement shear/adhesion strength method and define test method for nano-indentation measurements in Bosch BrgP. These tasks are conducted collaboratively in Bosch BrgP's laboratory and production environments, plus University of Minho for further testing like DMA and TMA. The highly specialized and innovative team drives success with technological know-how.
At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm. We value diversity, equal opportunities, and applications from people with disabilities, providing reasonable accommodations. Work #LikeABosch with global exchange, training opportunities, and continuous professional development.
Requirements
- Knowledge in materials characterization techniques, chemical analysis and material science
- Knowledge in testing and statistical methods
- Preferred high knowledge in Materials Engineering and mechanical
- Proficiency with Microsoft Office tools
- Experience in lab environment (mandatory)
- Good written and verbal communication skills in English (mandatory)
- Team working and collaboration ability
- Critical thinking and problem solving skills
Responsibilities
- Conduct state-of-the-art review of Underfill in the semiconductor industry
- Identify relevant material properties and influence on reliability
- Perform material characterization including thermal analysis, rheology, chemical analysis, DMA and TMA
- Implement shear/adhesion strength method in Bosch BrgP
- Define test method for nano-indentation measurements in Bosch BrgP
Benefits
- Exchange with colleagues around the world
- Medical office (psychology and general clinic) & Social Services Office on site
- Training opportunities (technical training, foreign languages training)
- Continuous professional development
- Access to great discounts in partnerships and Bosch products
- Sports and health related activities
- Free transport from Porto
- Free parking lot
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